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Остальное
Portable SSD T7 Touch
 
Samsung представляет портативный твердот
AR236.B и AR232.B
 
Радиорегистраторы AR236.B и AR232.B фирм
JZ- 500 и JZ-500-C
 
Провода JZ- 500 и JZ-500-C черного цвета
HF41F
 
Сверхминиатюрные реле мощности серии HF4
GT-900B
 
Наборы инструментов в чемодане от фирмы
MC4
 
Наборы солярных разъемов MC4
WIHA-SB24670
 
Многофункциональный фонарь LED марки WIH
G2RV-SR
 
Релейные модули сопряжения OMRON серия G
Tektronix AFG31000
 
Компания Tektronix переопределяет поняти
CFast 2.0
 
Высокопроизводительные карты памяти CFas
Компоненты
Герметичные реле фирмы Hongfa Relay
Герметичные реле фирмы Hongfa Relay
Автомобильные реле с конфигурацией контактов SPDT предназначены для монтажа в подставке. Характеризуются стойкостью к пыли и влажности. Версия оборудована чувствительной катушкой 12 В DC и резистором, погашающим перенапряжения. Контакты покрыты сплавом AgSnO2 и могут пропускать постоянный ток 30 A (резистивная нагрузка). Реле HONGFA RELAY работают при температуре -40…+125°C.
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Even greater number of mating cycles with the push-pull connector Y-Circ P with protection rating IP68
The waterproof T-series of the Y-Circ P push-pull circular connector family from Yamaichi Electronics has now been qualified for up to 5,000 mating cycles. In addition, the connectors are now available in size 09, 12, 15 and 18.
.....
Even greater number of mating cycles with the push-pull connector Y-Circ P with protection rating IP68
FLH Mini Sealed 2.50mm Connectors
FLH Mini Sealed 2.50mm Connectors
Amphenol's FLH Series Mini Sealed 2.50mm pitch connectors provide a wire-to-wire IP67 sealing in mated conditions. Its compact and waterproof characteristics make it ideal for applications in rugged environments as well as industrial, lighting appliances, HVAC and smart home.
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The king among Cat 4 LTE modules
New Quectel EG25-G is an LTE Cat 4 module optimized specially for M2M and IoT applications. It is the worldwide 4G compatible module and thanks to adopting the 3GPP Rel. 11 LTE technology, it delivers maximum data rates up to 150Mbps downlink and 50Mbps uplink. Modul EG25-G is already available to order.
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The king among Cat 4 LTE modules
Microchip Expands Silicon Carbide (SiC) Family of Power Electronics to Provide System Level Improvements in Efficiency, Size and Reliability 
Microchip Expands Silicon Carbide (SiC) Family of Power Electronics to Provide System Level Improvements in Efficiency, Size and Reliability
700, 1200 and 1700V SBD-based power modules maximize switching efficiency, reduce thermal rise and allow smaller system footprint
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Power Integrations’ SCALE-iDriver for SiC MOSFETs Achieves AEC-Q100 Automotive Qualification
Compact and robust isolated SiC MOSFET driver incorporates active clamping and <2 µs short-circuit turn-off time
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Power Integrations’ SCALE-iDriver for SiC MOSFETs Achieves AEC-Q100 Automotive Qualification
Protect Against Rootkit and Bootkit Malware in Systems that Boot from External SPI Flash Memory
Protect Against Rootkit and Bootkit Malware in Systems that Boot from External SPI Flash Memory
Microchip’s new cryptographic MCU, custom firmware and provisioning service are designed to enable platforms to detect and stop malicious firmware prior to run time
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Nexperia delivers first ESD protection device for USB4
TrEOS diodes fully support USB4TM standard; devices feature low clamping, low capacitance, low leakage and very robust
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Nexperia delivers first ESD protection device for USB4 
Power Integrations Expands Range of InnoSwitch3 ICs Incorporating Robust 750 V GaN Transistors
Power Integrations Expands Range of InnoSwitch3 ICs Incorporating Robust 750 V GaN Transistors
PowiGaN technology permits manufacture of 94% efficient power supplies suitable for regions with frequent brown-outs and line surges
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7 COLOURS of Terminal Blocks
Green, grey, black, blue, red, yellow and orange - using Euroclamp coloured terminal blocks radically reduces the possibility of incorrect connecting of the cables.
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7 COLOURS of Terminal Blocks
Aluminum electrolytic capacitors: Compact design with high ripple current capability
Aluminum electrolytic capacitors: Compact design with high ripple current capability
TDK Corporation (TSE:6762) presents the new B43707* and B43727* series of EPCOS aluminum electrolytic capacitors with screw terminals. They are designed for rated voltages of between 400 V DC and 450 V DC and cover a capacitance range from 1800 µF to 18,000 µF.
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Vishay Intertechnology AEC-Q200 Qualified Thick Film High Power Resistors Reduce Component Counts, Lower Costs
Designed for Direct Mounting on a Heatsink, Devices Offer Rated Power to 800 W and Pulse Handling Capability to 1500 J
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Vishay Intertechnology AEC-Q200 Qualified Thick Film High Power Resistors Reduce Component Counts, Lower Costs
Infineon – IHV-B 3.3 kV single switch module FZ2000R33HE4 and FZ1400R33HE4 
Infineon – IHV-B 3.3 kV single switch module FZ2000R33HE4 and FZ1400R33HE4
The well-known IHV-B 3.3 kV single switch IGBT module has been improved heavily to meet current and future requirements for traction and industry applications such as Medium Voltage Drives or HVDC.
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Coin-Cell-Supercaps by EATON
EATON offers a wide selection of coin-cell-super-capacitors in various mechanical versions. Due to the current market situation, we advise to implement new designs or approvals quickly and to secure production capacities.
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Coin-Cell-Supercaps by EATON
Ultra-Low Power and Security for IoT Come First on New STM32L5 Microcontrollers from STMicroelectronics
Ultra-Low Power and Security for IoT Come First on New STM32L5 Microcontrollers from STMicroelectronics
STMicroelectronics announces ultra-low-power STM32L5x2 microcontrollers (MCUs) that emphasize security to assure better protected IoT-connected applications.
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New PIC® MCU Family Moves Software Tasks to Hardware for Faster System Response
Microchip’s PIC18-Q43 family combines more Core Independent Peripherals and an extensive development tool ecosystem for improved designs in real-time control and connected applications
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New PIC® MCU Family Moves Software Tasks 
TI's EMI-optimized integrated transformer technology miniaturizes isolated power transfer into IC-sized packaging
TI's EMI-optimized integrated transformer technology miniaturizes isolated power transfer into IC-sized packaging
Engineers can shrink their power solution by as much as 80% and maximize efficiency in high-voltage industrial applications with a new high-density, isolated DC/DC bias power supply
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Advantech Releases NXP i.MX8 QuadMax ROM-7720, Qseven Module for AI and Machine Vision Application
Advantech is pleased to announce its first NXP i.MX8 product: ROM-7720, an Arm-based Qseven module powered by the NXP Arm® CortexTM-A72 i.MX8 high-performance processor. ROM-7720 supports 4K resolution via HDMI 2.0 with H.265 H264 hardware accelerator engines for video decoding and additional GPU for image processing. Using OpenVX, it is ideal for AI, machine vision, and big data processing and analytics applications in the IoT era.
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Advantech Releases NXP i.MX8 QuadMax ROM-7720, 
Interesting video


Arduino LED filament clock


How Intel Makes Chips: Concept to Customer


Ghostbuster's Theme on eight floppy drives


Darude - Sandstorm on Eight Floppy Drives


HDD and Floppy Music: Nirvana - Smells Like Teen Spirit
Компания недели

TTI, Inc.
Бизнес каталог


TTI, Inc.


ANRITSU


Power Integrations


AXIOMTEK


TDK Corporation


VISHAY


STMicroelectronics


Texas Instruments


Advantech


Microchip Technology Inc.


Molex, LLC


ON Semiconductor


NeoPhotonics


NEXPERIA


Murata Manufacturing Co.,


FARNELL


ICP Deutschland GmbH


SEMTECH


Yamaichi Electronics USA Inc.


TE Connectivity


akYtec GmbH


MARVELL


Taiwan Semiconductor




Pickering Interfaces Ltd


Foremost Electronics


RS Components Sp. z o.o.


SECTRON


Willow Technologies


ABB
Календарь
ExpoElectronica, Москва, 14.4.-16.4.2020
CWIEME Berlin, 26.5.-28.5.2020
Электро 2020, ЦВК «Экспоцентр», Москва, 8.6.-11.6.
SMTconnect 2020, Nuremberg, 28.7.-30.7..2020
MIMS Automechanika, ЦВК "Экспоцентр", Москва, 24.8
IMTS2020, 14.9.-19.9.2020, Chicago, IL
Interlight Russia, Москва, 14.9.-17.9.2020
Prolight + Sound NAMM, Москва, 17.9.-19.9.2020
NEPCON Nagoya, Japan, 21.10.-23.10.2020
SPS 2020, Nuremberg, 24.11.-26.11.2020
NEPCON Japan, Tokio, 20.1.-22.1.2021
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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