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conga-TR4
 
Модуль congatec COM Express на базе проц
BHI260AB
 
An All-in-One Programmable Smart Sensor
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Lattice Reinvents the Low Power, General-Purpose FPGA with New Certus-NX
Lattice Semiconductor launched the new Lattice Certus™-NX family of FPGAs. The devices lead the general-purpose FPGA market in I/O density, delivering up to twice the I/O density per mm2 in comparison to similar competing FPGAs, and provide best-in-class power savings, small size, reliability, instant-on performance, and support fast PCI Express (PCIe) and Gigabit Ethernet interfaces to enable data co-processing, signal bridging, and system control.

RSL10 Mesh Platform from ON Semiconductor Enables Smart Building and Industrial IoT Bluetooth® Low Energy Mesh Applications
Strata-enabled solution supports node-to-node communication with smart sensing and cloud connectivity

QPL-qualified SupIR-SMD package for rad hard MOSFETs enables higher performing space power systems
Reliably attaching surface mount hermetic power packages to PCBs is a common challenge faced by space system designers.

Nexperia delivers widest range of AEC-Q101 discretes in miniature, leadless rugged DFN packages
Nexperia today announced the industry’s widest portfolio of automotive-qualified discretes in space-saving, thermally-efficient, AOI-compatible DFN (Discrete Flat No leads) packages. The AEC-Q101 range of devices available cuts across all Nexperia’s product groups and includes switching, Schottky, Zener and protection diodes, bipolar junction transistors (BJTs), N- and P-channel MOSFETs, resistor-equipped transistors and LED drivers.

WEBINAR: Telematics Innovation: Opportunities & Challenges .. June 30th, 2020, 02:00 p.m. (CET)
As automotive telematics continues to enhance driving performance and experience, it’s creating opportunities for OEMs and the extended supply chain. We’re seeing huge amounts of innovation taking place in this field, helping to improve digital cockpits, in-vehicle connectivity, security and more.

Компания congatec представляет комплект решения для Интернета вещей Intel IoT RFP Kit, предназначенный для консолидации рабочих нагрузок в приложениях ситуационной осведомленности на основе компьютерного зрения
Не только увидеть, а и понять

Microchip Introduces 3 kW Transient Voltage Suppressor Diode Array Family for Superior Circuit Protection in Harsh Environments
Highest reliability diode arrays available protect aircraft, space systems and critical infrastructure from surges, spikes and electrostatic events

Philips Lumify handheld ultrasound solution launched in Japan to enable powerful diagnostics at the bedside

Ochrana osobních údajů (GDPR)
Provozovatel internetového portálu prohlašuje, že osobní údaje získané v souvislosti s provozem internetového obchodu zpracovává v souladu s nařízením Evropského parlamentu a Rady EU 2016/679 o ochraně fyzických osob v souvislosti se zpracováním osobních údajů ( známé jako GDPR).

Nexperia announces next generation 650 V Gallium Nitride (GaN) Technology
Next-gen GaN technology targets automotive, 5G and datacenter applications; Devices available packaged in TO-247 and innovative Copper Clip SMD

Microchip Switchtec™ PAX Advanced Fabric Gen 4 PCIe Switches Released to Production
Switchtec PAX PCIe fabric solutions provide greater flexibility and scalability for data center and cloud AI and ML architectures

Arrow Electronics, Panasonic Industry, and STMicroelectronics Join Forces to Deliver IoT Modules for Smart Applications
Low-Power Wireless Multi-Sensor Edge-Intelligence Modules Address Smart Factory, Smart Home and Smart Life Solutions

Lattice Accelerates FPGA-based Processor Design with New IP Ecosystem and Design Environment
Lattice Propel Provides RISC-V Support and a Robust IP Portfolio to Enable Development of Processor-based Systems in Minutes

WEBINAR: NXP Introduces New MIFARE DESFire EV3 IC
JUNE 16, 2020 | 60-MINUTE WEBINAR | 9:00 AM CEST

KEMET Extends KC-LINK™ Range Using KONNEKT™ High-Density Packaging Technology
Designed for use by power electronics engineers where high-power density and high efficiency in a small form factor is critical

NXP Introduces MIFARE DESFire EV3 IC, Ushers In New Era of Security and Connectivity for Contactless Smart City Services
NXP Semiconductors today announced its new MIFARE DESFire EV3 IC that ushers in next-generation performance, advanced security and seamless integration of mobile services for a new era of security and connectivity in smart city services.

Silicon Germanium (SiGe) rectifiers from Nexperia combine cutting-edge high efficiency, thermal stability and space-savings
AEC-Q101 approved devices with 120 V, 150 V, and 200 V combine best attributes of Schottky and fast recovery diodes

CoolSiC™ MOSFET 1700 V SMD enables best efficiency and reduced complexity for high voltage auxiliary power supplies
Infineon Technologies AG complements its CoolSiC™ MOSFET offering with yet another voltage class. Having added 650 V to the portfolio earlier this year, the company is now launching the 1700 V class with its proprietary trench semiconductor technology.


Interesting video


VIDEO (EN): How to mount congatec cooling solutions (COM Express Type 7, 6 and 2)


Phoenix Contact Dialog Days - 12.-16.4.2021


Arduino LED filament clock


How Intel Makes Chips: Concept to Customer



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RUTRONIK


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TTI, Inc.


ANRITSU


Power Integrations


AXIOMTEK


TDK Corporation


VISHAY


STMicroelectronics


Texas Instruments


Microchip Technology Inc.


Molex, LLC


ON Semiconductor


NeoPhotonics


NEXPERIA


Murata Manufacturing Co.,



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Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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