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06.06.2023 1:01:55
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Murata introduces Mass Production of a FORTELION 24V Battery Module for Industrial Equipment
Murata Manufacturing Co., Ltd. has developed a FORTELION 24V Battery Module (all-in-one type) that is ideal for industrial equipment requiring high output such as automated guided vehicles (AGVs)*1 and robots.
Nexperia launches P-channel MOSFETs in robust, space-saving LFPAK56 package
Nexperia, the expert in essential semiconductors, has launched industry’s first family of P-channel MOSFETs in the robust, space-saving LFPAK56 (Power-SO8) package. AEC-Q101 qualified for automotive applications, the new devices are an ideal replacement for DPAK MOSFETs, offering a reduction in footprint of over 50% whilst maintaining high performance levels. The new products are available in 30 V – 60 V, with RDS(on) down to 10 mΩ (30 V)
120W 1/8th brick DC-DC converter with 9-36Vdc range for industrial applications
Murata Electronics today announced that it has expanded its UWE family of DC-DC converters by Murata Power Solutions to include the UWE-Q12 series. This new product offers greater design flexibility because of the 9-36Vin range, 120 Watt rating, high efficiency, and cost effectiveness that it delivers.
KEMET Introduces Metal Composite Power Inductors for Automotive Applications
METCOM™ for automotive offers high reliability and performance with best in class EMI shielding for low magnetic flux leakage
SFP28 High-Speed Connector for Data Networking Optical Transceiver Applications
Yamaichi Electronics offers the SFP28 host connector for a data transmission rate of 56 Gbps PAM-4 modulation per one channel.
Murata Begins Mass Production of World's Smallest PTC Thermistor Contributing to Improving the Safety of Multifunctional Smartphones and Small Wearables
New Functional Safety Ready AVR® DA Microcontroller Family Enables Real-Time Control, Connectivity and HMI Applications
Next-generation AVR MCU family features core independent peripherals, advanced analog and on-chip communications
Murata and Google team to develop world’s smallest AI module with Coral intelligence
Murata announces that it has created the world’s smallest artificial intelligence (AI) module in partnership with Google – the Coral Accelerator Module. The custom designed module packages Google’s Edge TPU ASIC within a miniaturized footprint.
Inductors: Compact dual inductors with high saturation current
TDK Corporation has extended its range of dual inductors to include the new EPCOS series B82477D6*. The seven series types cover an inductance range from 2 x 3.9 µH to 2 x 47 µH and are designed for maximum rated currents from 2.83 A to 7.05 A. A special feature of the inductors, which are certified according to AEC-Q200 and compatible with RoHS, are the high saturation currents of up to 16.1 A.
DINKLE BUS Housingsystem
In addition to the extremely compact housing widths of 12mm and 20mm DINKLE is now offering 40mm and 60mm versions for additional electronics installation space. The new standard widths offer sufficient space to accommodate capacitors, relays or other high electronic components on the PCB.
10th Gen Intel Core H-series Introduces the World’s Fastest Mobile Processor at 5.3 GHz
What’s New: Today, Intel breaks beyond the 5 GHz barrier for laptops with the launch of the 10th Gen Intel® Core™ H-series mobile processors. Headlined by the 10th Gen Intel Core i9-10980HK1 processor, the H-series delivers desktop-caliber performance that gamers and creators can take anywhere.
Ultra-tiny MOSFETs from Nexperia are 36% smaller with lowest RDS(on)
Nexperia has launched a range of MOSFETs in the ultra-small DFN0606 package for mobile and portable applications including wearables. The devices also offer the lowest RDS(on) for their size and employ the commonly used pitch of 0.35 mm to simplify PCB assembly processes.
An All-in-One Programmable Smart Sensor for Always-On Applications
For all those high-tech applications such as fitness tracking, step counting, indoor navigation and gesture recognition on your smart watch, smartphone or other mobile devices, all require ultra-low power, high performance smart sensors.
Power Integrations’ GaN Technology Increases Output Power of High-Efficiency Display PSUs to 75 W
Power Integrations announced that its InnoSwitch™3-MX isolated switcher IC family has been expanded with the addition of three new PowiGaN™ devices. As part of a chipset with Power Integrations’ InnoMux™ controller IC, the new switcher ICs now support display and appliance power supply applications with a continuous output power of up to 75 W without a heatsink.
AMD Expands 3rd Gen AMD Ryzen™ Desktop Processor Family, Unleashing Powerful “Zen 2” Core For The Mainstream
AMD announced the newest additions to the 3rd Gen AMD Ryzen desktop processor family, the AMD Ryzen™ 3 3100 and AMD Ryzen™ 3 3300X processors and AMD B550 Chipset for Socket AM4 designed for 3rd Gen AMD Ryzen desktop processors with over 60 designs in development.
Infineon – CIPOS™ Mini IM564-X6D
The IM564-X6D is a new 20 A CIPOS™ Mini PFC-integrated IPM that combines a single boost PFC and three-phase inverter in one package. The PFC integration into inverter IPM helps to reduce significant PCB area and simplify manufacturing process to reduce overall system cost.
Rugged enclosure for PIM testing in complex multi-band 4G and 5G networks
Foremost Electronics, the engineering-led Essex based importer and specialist distributor of electromechanical components, works closely with its global suppliers to provide bespoke solutions for its customers where standard products do not meet the needs of the end product.
New solar fuses offer higher amperage in a streamlined, single case design
Littelfuse announced today the expansion of its SPXI series in-line solar fuses to include 35 to 60 amperage models. Designed to integrate into in-line assemblies within a wire harness, these 1500 V DC solar fuses protect photovoltaic (PV) installations from overloads and short circuits to minimize damage to solar panels.


Interesting video


Video Report from AMPER 2022


ПРОМЫШЛЕННЫЕ ПРЕОБРАЗОВАТЕЛИ ДАВЛЕНИЯ МАРКИ CYNERGY3


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Intel Alder Lake Product Video

Компания недели

AERS


Бизнес каталог


AERS

Flex Power Modules


Danisense

BINDER


Parker Hannifin

DANFOSS


MOXA

Alliance Memory


Intelliconnect (Europe) Ltd.

KIOXIA Europe GmbH


Antenova Ltd

Friedrich Lütze GmbH


Analog Devices

ASRock Industrial


NVIDIA

Yamaichi Electronics USA Inc.


Laird Thermal Systems

HARTING


A.P.O. - ELMOS v.o.s.

MACH SYSTEMS s.r.o.


Pico Technology

Lynred


Advantech

EBV


SECO S.p.A.

Crowd Supply


Digi-Key Electronics

Durakool


KEMET

INTEL


Календарь
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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